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Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science)

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Pages: 388

Language: English

Book format: An electronic version of a printed book that can be read on a computer or handheld device designed specifically for this purpose.

Publisher: Springer: Softcover reprint of Pdf 1st ed. 2007 edition (19 Nov. 2010)

By: King-Ning Tu (Author)

The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.


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