Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science)
Book format: An electronic version of a printed book that can be read on a computer or handheld device designed specifically for this purpose.
Publisher: Springer: Softcover reprint of Pdf 1st ed. 2007 edition (19 Nov. 2010)
By: King-Ning Tu (Author)
The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.